🔋Power Via technology separates power and signal wires, improving performance and reducing interference.
💡Backside power delivery allows for more efficient use of space on the chip.
💰Power Via technology reduces manufacturing costs and complexity.
🔥Intel claims that Power Via results in over 5% higher core frequency on E-cores.
🌍Other chip makers, such as Samsung and TSMC, are also working on their own versions of backside power delivery.
What are the benefits of Power Via technology?
—Power Via technology improves performance, reduces interference, lowers manufacturing costs, and allows for more efficient use of space on the chip.
When will the first Intel chips with Power Via be available?
—The first Intel chips with Power Via are expected to hit the market in mid-2024.
Are there any downsides to Power Via technology?
—Some enthusiasts have raised concerns about thermal conductivity through the layers of front side wiring, but Intel claims that cooling CPUs with Power Via is no more difficult than with traditional chips.
Are other chip makers working on similar technologies?
—Yes, other chip makers like Samsung and TSMC are also working on their own versions of backside power delivery.
What is the significance of separating power and signal wires?
—Separating power and signal wires reduces interference and allows for improved performance.
00:00Intel is introducing Power Via technology, which separates power and signal wires on CPUs.
01:10Backside power delivery allows for more efficient use of space on the chip and improves performance.
02:56Power Via technology reduces manufacturing costs and complexity.
03:22Intel claims that Power Via results in over 5% higher core frequency on E-cores.
03:59Other chip makers, such as Samsung and TSMC, are also working on their own versions of backside power delivery.
