Analyzing the Failure of a CPU: Unveiling the Aftermath and Root Cause

🔍Through acoustic scanning, x-ray analysis, and scanning electron microscopy, we uncover the internal defects of the failed CPU and determine the root cause of failure.

🔬The melted copper BGA bumps connecting the substrate to the CCD indicate extremely high temperatures and are likely a result of an overcurrent event.

⚙️Manufacturing defects, such as voids in the solder application, are ruled out as the cause of the CPU failure.

🧪The failure analysis lab plays a crucial role in conducting non-destructive and destructive testing to assess the damage and determine the failure's root cause.

🔍Scanning electron microscopy reveals the structural damage and provides further insight into the failure mechanism.

What is acoustic scanning, and how does it help in failure analysis?

—Acoustic scanning uses high-frequency ultrasonic energy to detect defects in solder application and determine if the die underneath the IHS is cracked.

What does x-ray analysis reveal about the failed CPU?

—X-ray analysis shows melted copper BGA bumps connecting the CCD to the substrate, indicating extremely high temperatures and a possible overcurrent event.

Are manufacturing defects responsible for the CPU failure?

—No, manufacturing defects, such as voids in the solder application, are ruled out as the cause of the failure.

What role does the failure analysis lab play in the investigation?

—The failure analysis lab conducts non-destructive and destructive testing, including acoustic scanning, x-ray analysis, and scanning electron microscopy, to assess the damage and determine the root cause of the failure.

What additional insights does scanning electron microscopy provide?

—Scanning electron microscopy reveals the structural damage of the CPU and provides further insight into the failure mechanism.

00:00Introduction and purpose of the video

01:30Discussion of different failure analysis techniques

05:15Acoustic scanning reveals defects in solder application and potential cracks in the die

09:40X-ray analysis shows melted copper BGA bumps connecting the CCD to the substrate

13:25Ruling out manufacturing defects as the cause of failure

16:10Importance of the failure analysis lab in the investigation

18:45Scanning electron microscopy reveals the structural damage and provides further insights